TE Connectivity expands its VITA 66 optical backplane interconnect family

TE Connectivity (TE) has expanded its VITA 66 optical backplane interconnect family with the new VITA 66.5 Style D optical modules.

The company, which specialises in


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TE Connectivity (TE) has expanded its VITA 66 optical backplane interconnect family with the new VITA 66.5 Style D optical modules.

The company, which specialises in connectivity and sensors, said the high-density modules provide a rugged, blind-mate optical interconnect solution for aerospace, defence, and marine applications.

The VITA 66.5 Style D optical modules feature up to three mechanical transfer (MT) ferrules per insert and a floating receptacle design for optimal alignment.

Available in full-size and half-size configurations, they offer versatility for various system designs and are also designed to withstand harsh environments and meet military and aerospace specifications.

TE Connectivity product manager Anders Thelin said: “The VITA 66.5 Style D, 3 MT optical modules address the growing need for higher data rates and bandwidth in embedded computing applications.

“This expansion of our VITA 66 family demonstrates our commitment to providing advanced connectivity solutions for challenging environments.”

He added the key benefits of the VITA 66.5 Style D, 3 MT optical modules include easy integration with common mounting interfaces for 3U and 6U VPX applications; a rugged design based on proven optical termini for various applications and high performance with up to 3 MT ferrules per insert and floating alignment capability.

The VITA 66.5 Style D, 3 MT optical modules are suitable for applications such as embedded computing, secure communications, avionics, radar and imaging systems.

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